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“MLCAD 2025 국제 경진대회 종합 2위 수상” (반도체공학과 강석형 교수 / 학부과정 강시은, 심연우)
2025. 09. 17
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2025-09-17 11:23
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POSTECH CSDL Wins 2nd Place at the MLCAD 2025 Contest
The CAD & SoC Design Laboratory (CSDL) of POSTECH, led by Prof. Seokhyeong Kang, placed second overall in the MLCAD 2025 Contest (homepage),— ReSynthAI: Physical-Aware Logic Resynthesis for Timing Optimization Using AI, co-organized by Arizona State University (ASU) and NVIDIA.
The contest was held as part of the 7th ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD 2025), which took place in Santa Cruz, California, USA.

A Global Competition
This year’s contest attracted 27 research teams from leading universities and companies worldwide, including IMEC, NXP, Samsung, UT Austin, Texas A&M, UC Davis, CUHK, and Fudan University. POSTECH CSDL competed as Team 13 (CSDL) among participants from top institutions.
Contest Theme & Tasks
The 2025 challenge, ReSynthAI: Physical-Aware Logic Resynthesis for Timing Optimization, focused on physical-aware logic resynthesis for timing optimization after global routing. Teams were asked to apply AI methods—supervised, unsupervised, and reinforcement learning—to perform netlist-level optimizations such as gate sizing, buffer insertion, Vt swaps, gate cloning, and logic restructuring, all while ensuring routability and minimizing congestion. (Github)
Final Results
1st Place: Fudan University (764 points)
2nd Place: POSTECH (713 points)
3rd Place: NXP (482 points)
POSTECH CSDL excelled by ranking first in 5 out of the 12 benchmarks, demonstrating competitiveness nearly equal to Fudan University. Despite a narrow point margin in the final tally, the team secured an outstanding second place overall.
Significance
This performance highlights POSTECH CSDL’s world-class expertise in AI-driven semiconductor design automation. By showcasing innovative approaches to physical-aware optimization, the lab has reaffirmed its role as a leader in bridging AI and EDA. Looking ahead, CSDL will continue to pursue research that advances both academic excellence and industrial innovation at the forefront of AI and semiconductor design.
The CAD & SoC Design Laboratory (CSDL) of POSTECH, led by Prof. Seokhyeong Kang, placed second overall in the MLCAD 2025 Contest (homepage),— ReSynthAI: Physical-Aware Logic Resynthesis for Timing Optimization Using AI, co-organized by Arizona State University (ASU) and NVIDIA.
The contest was held as part of the 7th ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD 2025), which took place in Santa Cruz, California, USA.

A Global Competition
This year’s contest attracted 27 research teams from leading universities and companies worldwide, including IMEC, NXP, Samsung, UT Austin, Texas A&M, UC Davis, CUHK, and Fudan University. POSTECH CSDL competed as Team 13 (CSDL) among participants from top institutions.
Contest Theme & Tasks
The 2025 challenge, ReSynthAI: Physical-Aware Logic Resynthesis for Timing Optimization, focused on physical-aware logic resynthesis for timing optimization after global routing. Teams were asked to apply AI methods—supervised, unsupervised, and reinforcement learning—to perform netlist-level optimizations such as gate sizing, buffer insertion, Vt swaps, gate cloning, and logic restructuring, all while ensuring routability and minimizing congestion. (Github)
Final Results
1st Place: Fudan University (764 points)
2nd Place: POSTECH (713 points)
3rd Place: NXP (482 points)
POSTECH CSDL excelled by ranking first in 5 out of the 12 benchmarks, demonstrating competitiveness nearly equal to Fudan University. Despite a narrow point margin in the final tally, the team secured an outstanding second place overall.
Significance
This performance highlights POSTECH CSDL’s world-class expertise in AI-driven semiconductor design automation. By showcasing innovative approaches to physical-aware optimization, the lab has reaffirmed its role as a leader in bridging AI and EDA. Looking ahead, CSDL will continue to pursue research that advances both academic excellence and industrial innovation at the forefront of AI and semiconductor design.



